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Elevator Style Clamping
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Dovetail Interlocking Feature
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RoHS WEEE Pb free surface compliant
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| Description |
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Type 140-B-111 terminal block has been specially designed to allow effective potting of PC boards. The molding design prevents seepage of the potting material into the wire clamping area up to 10 mm (0.4 in.). from the board.
 | Dovetail version |
| Medium tall profile |
| Wire entrance parallel to PC Board |
| Elevator-style clamping mechanism |
| Can be installed anywhere on PCB without wires or screws interfering with other components. |
| The 2 and 3 poles units can be factory, field or distributor assembled to almost any number of poles |
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| Technical Data |
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Center to Center Spacing: 5 mm (0.197 in.)
Nominal Cross Section: 1.5 mm2 (2325 mils2)
Wire Stripping Length: 6 mm (0.25 in.)
Recommended Hole Diameter in PC Board: 1.2 mm (0.047 in.)
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| Dimensions: mm (in.) |
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Length of Connector (L)
L = No. of Poles x Center to Center Spacing |
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| When locating connector, allow 0.5 mm clearance around it for process-induced variations. |
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| Approval Information |
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UL File No.E69841  |
CSA File No.LR24322  |
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Rating
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Current(A)
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Voltage(V)
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Application
group
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AWG
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| UL |
10 |
300 |
B,C,D |
30-14 |
| CSA |
15 |
300 |
B |
30-14 |
| CSA |
10 |
150 |
D,E |
30-14 |
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* UL: 20A range for factory wiring only.
Screw Tightening Torque:
UL: 4.5 lbfin
CSA: 0.51 Nm
Rated Impulse Withstand Voltage: 2500 V
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| Material |
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Molding: Polyamide, self extinguishing UL 94, V-0, color grey
Temperature limits:
Short Time: 140°C (284°F)
Continuous: RTI 105°C (221°F)
Low Limit: -40°C (-40°F)
Comparative Tracking Index: CTI≥600V
Oxygen Index Rating: 33%
Terminal Body: Nickel plated copper alloy
Solder Pin and Pressure Plate: Tin plated copper alloy
Screw: M3, Slotted head, zinc plated blue passivated, steel substrate
Solder Pin: 0.9 mm x 0.5 mm (0.04 in. x 0.02 in.),
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