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Elevator Style Clamping
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Dovetail Interlocking Feature
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RoHS WEEE Pb free surface compliant
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| Description |
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Type 140-E-253 terminal block has been specially designed to allow effective potting of PC boards. The molding design prevents seepage of the potting material into the wire clamping area up to 9 mm (0.35 in.) from the board.
 | Dovetail version |
| Double level |
| Wire entrance parallel to PC Board |
| Back row offset to the right |
| Elevator-style clamping mechanism |
| The 4 and 6 poles units can be factory, field or distributor assembled to almost any number of poles |
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| Technical Data |
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Center to Center Spacing: 5 mm (0.197 in.)
Nominal Cross Section: 1.5 mm2 (2325 mils2)
Wire Stripping Length: 6 mm (0.25 in.)
Recommended Hole Diameter in PC Board: 1.2 mm (0.047 in.)
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| Dimensions: mm (in.) |
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Length of Connector (L)
L = (No. of Poles x Center to Center Spacing / 2) + 2.5 mm
(A) PCB hole layout |
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| When locating connector, allow 0.5 mm clearance around it for process-induced variations. |
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| Approval Information |
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UL File No.E69841  |
CSA File No.LR24322  |
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Rating
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Current(A)
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Voltage(V)
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Application
group
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AWG
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| UL |
10 |
300 |
B,C,D |
30-14 |
| CSA |
15 |
300 |
B |
30-14 |
| CSA |
10 |
150 |
D,E |
30-14 |
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* UL: 20A range for factory wiring only.
Screw Tightening Torque:
UL: 4.5 lbfin
CSA: 0.51 Nm
Rated Impulse Withstand Voltage: 2500 V
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| Material |
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Molding: Polyamide, self extinguishing UL 94, V-0, color grey
Temperature limits:
Short Time: 140°C (284°F)
Continuous: RTI 105°C (221°F)
Low Limit: -40°C (-40°F)
Comparative Tracking Index: CTI≥600V
Oxygen Index Rating: 33%
Terminal Body: Nickel plated copper alloy
Solder Pin and Pressure Plate: Tin plated copper alloy
Screw: M3, Slotted head, zinc plated blue passivated, steel substrate
Solder Pin: 0.9 mm x 0.5 mm (0.04 in. x 0.02 in.),
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