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Enlarged clamping area
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RoHS WEEE Pb free surface compliant
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| Description |
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Type 978-HENO (-DS) terminal block has been specially designed to allow effective potting of PC boards. The molding design prevents seepage of the potting material into the wire clamping area up to 14 mm (0.55 in.) from the board.
 | High clearance above PCB |
| Wire entrance parallel to PC Board |
| Enlarged clamping area |
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| Technical Data |
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Center to Center Spacing: 5 mm (0.197 in.)
Nominal Cross Section: 4 mm2 (6199 mils2)
Wire Stripping Length: 6.5 mm (0.26 in.)
Recommended Hole Diameter in PC Board: 1.3 mm (0.051 in.)
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| Dimensions: mm (in.) |
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Length of Connector (L)
L = No. of Poles x Center to Center Spacing |
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| When locating connector, allow 0.5 mm clearance around it for process-induced variations. |
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| Approval Information |
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UL File No.E69841  |
CSA File No.LR24322  |
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Rating
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Current(A)
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Voltage(V)
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Application
group
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AWG
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| UL |
20 |
300 |
B,D |
22-12 |
| CSA |
20 |
300 |
B,D,E |
22-10 |
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* Version DS is CSA certified for 26-10 AWG.
UL: 24-26 AWG range for factory wiring only.
Screw Tightening Torque:
UL: 4.5 lbfin
CSA: 0.51 Nm
Rated Impulse Withstand Voltage: 2500 V
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| Material |
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Molding: Polyamide, self extinguishing UL 94, V-0, color grey
Temperature limits:
Short Time: 140°C (284°F)
Continuous: RTI 105°C (221°F)
Low Limit: -40°C (-40°F)
Comparative Tracking Index: CTI≥600V
Oxygen Index Rating: 32%
Terminal Body: Tin plated copper alloy
Wire Protector: Tin plated copper alloy
Screw: M3, Slotted head, zinc plated blue passivated, steel substrate
Solder Pin: Ø 1.0 mm (0.04 in.), Tin plated copper alloy
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